UNITED MICROELECTRONICS CORPORATION (Singapore Branch) is seeking an OSAT & Advanced Packaging Engineer to drive advanced packaging with external partners. The role involves working with 2.5D and 3D packaging technologies and ensuring high-quality, cost-effective delivery while collaborating with various teams.

The ideal candidate should have a relevant bachelor's degree and at least 2 years of experience in OSAT R&D or related fields. Excellent English communication skills are essential.