채용제목 Advanced Packaging POC techinical leader (Heat Sink) (지원마감) 회사소개 반도체사 업무내용/자격요건 [담당직무]
-Advanced packaging new ideas ideation
-Market trend survey, competitors benchmarking
-Advanced packaging new materials, new equipment, new process study, survey
-Join R&D activities with customers, partners (institutes, equipment, material suppliers) 
-Advanced packaging design proposal, value propositions analysis and suggestion
-Advanced packaging proof-of-concept demonstration, characterization, reliability 

[자격요건]
-Strong knowledge and hands-on experience on semiconductor packaging technologies, process, materials, equipment
-Strong understanding of embedding and Cu plating (1 T/L)
-Strong problem solving, diagnosis technique and data analysis skill
-Strong English communication skill
-Bachelor (> 10 years), Master (> 7 years) or PhD degree (> 5 years) in Physics, Materials, Mechanical Engineering, Mechanics, Metallurgy, Electronics, Elec...