Job Description1. New SBT vendor bring up , New SBT vendor YIP , troubleshooting and Ops

2. 3D, 3.5D & e-IVR Technology Enabling, CPC/CPO technology building block development

3. Common strip format unification management

4. Advanced PCB Ultra-Large size. I.e., CoWoP, DCAI PCB w/ high layer counts (PCB vendor ISU, GCE, UMTC, VGT )

5. PCB technology development and DRM ownerRequirement1. New SBT vendor bring up , New SBT vendor YIP , troubleshooting and Ops

2. 3D, 3.5D & e-IVR Technology Enabling, CPC/CPO technology building block development

3. Common strip format unification management

4. Advanced PCB Ultra-Large size. I.e., CoWoP, DCAI PCB w/ high layer counts (PCB vendor ISU, GCE, UMTC, VGT )

5. PCB technology development and DRM owner