• Develop and execute Computational Fluid Dynamic (CFD) and thermal simulations for electronics cooling applications, including airflow, forced and natural convection, and conjugate heat transfer
• Support component-, board-, enclosure-, cabinet-, and sub-system–level thermal analysis for products such as circuit breakers, PLCs, laptops, and appliances
• Analyze industrial environments (EIA) including high ambient temperatures, enclosure heating, dust effects, and derating requirements
• Assist in rapid model setup and simulation turnaround to support internal service requests and customer engineering needs
• Apply appropriate boundary conditions including power losses (I²R, switching losses), contact resistance, and environmental loads
• Support steady-state and transient thermal analyses, including power cycling, duty cycles, startup conditions, and basic fault scenarios
• Evaluate airflow distribution in control panels, switchgear assemblies, and electronic enclosu...