Infineon Technologies in Singapore is seeking an intern for the package simulation team. The student will conduct finite element analysis using Ansys and LS-DYNA, analyze results for AI/ML model training, and evaluate various AI/ML-based finite element models. Candidates should be on track to attain a Master's in Mechanical Engineering, exhibiting strong analytical skills and experience with simulation software. The internship runs from June to December 2026 and offers valuable experience in a fast-paced environment.
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