Drive and manage silicon Bump & package assembly suppliers, backend processes and solutions to achieve aggressive TQRDCEB goals.
Work closely with package design & technology, test & product engineering, production planning, quality engineering & NPI teams, and assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, managing process improvements and changes.
Provide day‑to‑day support to bump and assembly suppliers and internal planning, product and test engineering teams.
Plan, drive and implement improvement activities for continual improvement, second sourcing, cost reduction and customer satisfaction.
Qualifications
PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7‑12 years of relevant experience managing advanced node silicon bumping, large body single and multi‑chip (2.1/2.5/3D) package ass...
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