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The DACA Engineer is responsible for developing, optimizing, and sustaining die attach manufacturing processes to achieve high product quality, reliability, and manufacturing efficiency. The engineer will collaborate with cross‑functional teams to drive process improvements, resolve technical issues, support new product introductions, and ensure stable production performance.
This role focuses on die attach assembly processes within semiconductor manufacturing. Responsibilities include process development, troubleshooting, yield improvement initiatives, equipment optimization, and supporting new package qualifications.