Job Details

Be a part of Intel's Advanced Packaging Command Center (APCC), the global command center for advanced packaging that provides remote capabilities, follow‑on engineering, and operational support across Wafer Packaging Manufacturing (WPM). Through APCC, engineering expertise is focused to improve coordination across regions, drive standardization, and improve responsiveness, while strengthening end‑to‑end operational execution across regions and delivering consistent, high‑quality execution at scale.

Key Responsibilities

• Defect Classification and Analysis: Review and analyze defect images captured by diverse metrology tools, accurately classify defects based on documented specifications, distinguish between true defects, false positives, or nuisance defects, and maintain proficiency across multiple inspection platforms while adapting classification criteria to different tool capabilities and imaging conditions.
• Defe...