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AMD’s Heterogenous Technology Integration (HIT) team is seeking an experienced leader to establish its Singapore Advanced Packaging Lab, a multi-disciplinary lab focused on accelerating the development of advanced packaging technologies for AMD’s AI product portfolio.
The team will enable and maintain metrologies across optical, electrical, mechanical, thermal, and imaging domains, while also identifying and partnering with external labs, equipment vendors, universities, and industry collaborators to develop new measurement capabilities. Beyond core metrology work, the team will support simulation, physical design, and other lab-related activities, and may interface with Asia-based manufacturing partners.
The ideal candidate will have direct experience managing and scaling technical teams, along with a strong network within the Singapore tech ecosystem to support team growth and partnership development. Hands‑on experience...