We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into predictable, scalable manufacturing execution that achieves production output, customer commit dates, and revenue targets. The scope includes AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This leader will oversee assembly line readiness, manufacturing execution, capacity utilization, cycle time, yield performance, quality control, process change management, and ramp readiness while partnering closely with Package Engineer...