The Director of Probe & Post‑Fab Operations is responsible for end‑to‑end leadership of wafer manufacturing activities from electrical probe through post‑fab processing, including wafer thinning and back side metallization. This role owns the transition from electrical qualification to wafer readiness for assembly, with accountability for yield, cost per wafer, wafer integrity, reliability, cycle time, and operational scalability.

A key responsibility of this role is to define and execute the automation strategy for Post‑Fab Operations, ensuring that post‑fab manufacturing systems, controls, and data integration resemble front‑end fab standards, while supporting a phased approach to material handling automation (onsemi assembly test operations and external assembly)

Leadership & Strategy