Dormont Manufacturing Co is seeking an Engineer in Package–Silicon Integration based in Singapore. This early-career position allows you to support NAND package and silicon integration for next-generation memory products under guidance.

Your responsibilities will include assisting in chip-package interaction assessments, participating in DFMEA/PFMEA activities, and collaborating with various engineering teams. Candidates should have a Bachelor’s or Master’s in Engineering and a basic understanding of semiconductor manufacturing.