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We are seeking a highly motivated Systems Semiconductor Packaging Engineer to join a multidisciplinary team developing advanced semiconductor modules and systems level solutions for Healthcare, Industrial, New Energy, Robotics and Physical AI applications.

This role will drive product realization from concept through manufacturing by working closely with cross-functional design teams, OSAT, ODM and EMS partners, material suppliers and global manufacturing vendors across multiple time zones. The ideal candidate should have 2 - 5 years of experience in semiconductor packaging, system integration, manufacturing process development and reliability engineering.

Potential candidate is expected to: