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Engineer, Staff/Manager (Wet Etch / Electroplating)

Company

Qualcomm

Location

singapore, singapore

Posted

June 03, 2026

Position Overview

Job Responsibilities
Lead and manage a wafer fab manufacturing engineering module specializing in Wet Etch and Electroplating processes Manage and develop a team of engineers and technicians in a high‑volume manufacturing environment Drive excellence in output, quality, cost, equipment uptime, and safety Ensure robust process control, stability, and integration across wet etch and plating operations Lead root‑cause investigations for process, quality, and equipment issues and drive permanent corrective actions Drive yield improvement, scrap reduction, and defect reduction through data‑driven analysis Ensure high equipment availability and reliability, particularly for wet benches and plating tools Apply and sustain SPC and statistical analysis tools to monitor and improve process performance Actively contribute to continuous improvement programs to resolve chronic manufacturing or quality issues Work closely with cross‑functional teams including Process Integration, Equipment, Quali...

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