Overview

The position requires the individual to perform full failure analysis until failure mechanism identification on internal and external customer returns.

Responsibilities

• Participate and execute on projects and tasks assigned by respective team leader / manager
• Understanding semiconductor device specifications
• Knowledge of bench test tools and setup up to verify device failure mode
• Use failure isolation techniques such as Emission Microscopy, OBIRCH to determine failure mechanism
• Chemical handling will be necessary for chemical decapsulation procedures (acids and bases)
• Mechanical microprobing at die-level for nodal analysis
• Good understanding of device schematics (transistor level)
• Report generation to be submitted to internal and external customers, and from time to time interact with external customers and counterparts

Qualifications

Education