Work Location: Batu Kawan and Bayan Lepas

Job Summary

The Package Failure Analysis Technician is responsible for performing detailed hands‑on analysis of semiconductor packages to identify defects and determine root causes of failures. This position plays a key role in supporting quality improvement initiatives, reliability investigations, and customer return analysis through the use of advanced failure analysis tools and techniques.

Key Responsibilities

• Execute failure isolation and root cause analysis on semiconductor packages and assemblies.
• Prepare samples using techniques such as cross‑sectioning, polishing, delayering, and decapsulation.
• Operate advanced analytical and sample preparation equipment, including:
• Mechanical grinders (manual and automated)
• Focused Ion Beam (FIB)
• X‑ray and optical inspection systems
• Acoustic microscopy
• Dry and wet etching proces...