πŸ‡ΊπŸ‡Έ USAJobs.work

America's Job Portal

← Back to USA Jobs

HBM Packaging Engineer – NPI & High-Speed Memory

Company

Micron Technology, Inc

Location

singapore, singapore

Posted

June 13, 2026

Position Overview

Micron Technology, Inc in Singapore is seeking an Engineer for the High Bandwidth Memory and New Product Introduction team. This role involves integrating AI-assisted tools to enhance product transitions from development to high-volume manufacturing.

The ideal candidate will have a degree in a relevant engineering field and strong analytical skills. Responsibilities include risk assessments and collaboration with manufacturing teams.

#J-18808-Ljbffr

Ready to Apply?

Join thousands of Americans building their careers

Apply Now