Global Connect Technologies in Mexico is seeking an experienced Integrated Circuit Package Design Engineer to design complex flip-chip-BGA packages for high-speed SerDes and high-power delivery. You will work closely with a worldwide R&D team to develop high-performance designs for ASICs used in AI, networking, HPC, and 5G.

The successful candidate will have over 8 years of experience, knowledge in signal integrity and power integrity, and capability in project management. Join us to contribute to cutting-edge technology!