Link-Worldwide is seeking a skilled Integrated Circuit Package Design Engineer in Mexico, Jalisco. This role involves designing complex packages for high-speed SerDes in cutting-edge technologies such as AI and 5G. You will join a global R&D team to develop high-performance designs and manage projects from inception to execution.
The ideal candidate will possess over 8 years of relevant experience and a strong background in signal integrity. Proficiency in tools like Cadence APD is essential, along with excellent organizational skills.
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