Process Integration Internship – NAND Structural Analysis

The process integration internship program provides students with training and practical experience in understanding NAND structural integration through inline characterization. The project focuses on analyzing the relationship between structural parameters, process performance, probe yield, and device operation, providing exposure to real‑world semiconductor manufacturing challenges.

The objective of this project is to analyze NAND structural integration using inline characterization data, to understand its impact on process performance, probe yield, and device operation.

In this project, the student will:

• Analyze NAND process integration flow and key structural parameters
• Evaluate the impact of inline NAND structural data on process performance, probe yield, and device oper...