1 North Coast Drive, Singapore

HVM PEE (High Volume Manufacturing Process and Equipment Engineering)

Chemical Mechanical Planarization (CMP) process optimization for throughput improvement/cost reduction

In high volume semiconductor manufacturing environment, maximizing fab throughput at low cost is a key enabler to remain competitive, especially with the increasing demand of memory chips to power technology and AI advancement. Chemical Mechanical Planarization (CMP) relies heavily on slurries and consumables such as polishing pads, disks, cleaning chemicals in daily operation. Innovative ideas are continuously generated from both process and hardware perspective to drive best in class performance and operational excellence.

The student will experience a real life process & equipment engineer role with exposure to fab operation and statistical data analysis tool...