This internship project focuses on yield improvement through advanced process analysis and wafer edge performance optimisation within semiconductor manufacturing. The intern will examine matching behaviour between N and W process flows and evaluate wafer edge exclusion performance to reduce yield losses attributed to edge‑related effects. The project emphasises data‑driven analysis, defectivity characterisation, and inspection metric enhancement to enable sustained manufacturing performance.

Identify key contributors to process mismatch and wafer edge yield loss, and develop analytical methodologies that strengthen yield performance and inspection accuracy in a production environment.

Analyse inline, defect, and inspection data across modules to uncover root causes of yield variation. Evaluate bevel and wafer edge behaviour, assess process sensitivity, and develop improved inspection algorithms that better r...