Backgrind Process Wafer Thickness run to run auto thickness adjustment enablement

Data analytics and machine auto-adjustment has been introduced in Micron manufacturing operations to improve efficiency. Auto drift detection analysis and correction will significantly improve the process efficiency.

Enable wafer thickness drift detection and auto correction.

• Explore various machine learning techniques for feature selection, simulation, evaluation, and measurement data.
• Explore inline and probe data correlation.
• Explore multiple variables optimization.
• Explore SPC.

Stable process with early drift detection and auto-correction.

Improve product quality control and process efficiency.

• General problem solving, data analytics, and SPC.