Project Title

Selective Solder Tooling Enhancement and BOL Conversion Readiness Enhancement

Overview

Enhance selective solder process robustness by introducing tooling improvements while strengthening BOL conversion readiness by introducing a standardized tooling selection system covering Cornerfill (CF), Selective Solder (SS) and Enclosure Assembly (EA). The project aims to reduce conversion ambiguity, setup errors and process variability across BOL operations.

Scope

• Selective Solder Tooling Enhancement (SS) – Qualify and release selective solder process enhancement toolings to improve setup stability, consistency and repeatability; address tooling‑related contributors to process variation during selective solder operations.
• BOL Conversion Readiness Enhancement (CF, SS, EA) – Develop and implement a tooling selection system defining required toolings for each product conversion across BOL; standardize tooling requirements to...