We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional exposure to wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This position will focus on yield improvement, process stability, quality support, process change execution, and manufacturing readiness while working closely with Package Engineering, Product Engineering, Quality, Supply Chain, and external OSAT partners to support New Product Introduction (NPI) transfer into high-volume manufacturing (HVM).

The ideal candidate combines strong semiconductor packaging assembly knowledge with hands...