This position is in our semiconductor DieFab area in Santa Rosa, California. We manufacture integrated circuits in support of our internal and external customers.
You will be part of a team that handles both production and development circuits; you will work closely with engineering groups, area trainers and other operators.
Though you will be part of a team, you will be working independently to contribute to the area's goals. The scope and complexity of your work will be based on your current capabilities and your ability to gain new skills.
The bonding service position requires the ability to handle delicate products as instructed by the product documentation and engineering specifications.
Operators are responsible for following diagrams to solder, epoxy, and wire bond chips to packages so the parts can be tested for future r...
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