Be the subject matter expert of microelectronic assembly team and advise Design Engineering early in new product development to ensure designs are manufacturable
Operate and supervise, including setup, die attachment and wire bonding equipment for all microelectronics assembly processes
Responsible to develop, design, and test standards and guidelines for developing microelectronics packaging solutions for customer products in aerospace and defense applications
Responsible to define, develop and qualify new packages such as leadframe/substrate layout, bonding diagram, package outline drawing
Develop assembly processes and establish process documentation that are stable, repeatable, and reliably meet design requirements
Qualifications
Degree/Diploma in electronic/mechatronic or any other engineering equivalent
Min 5-7 years of related microelectronics assembly experience
P...
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