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Job#80142
Job Purpose
The Microelectronic Design Engineering team, as part of our company's Global Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology, thermal, structural and reliability engineering.
We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.
Nature of Duties/Responsibilities: