Responsibilities:

• new semiconductor package project implement on Memory product ( DRAM, Flash, LPDDR, eMMC, UFS) in Sao Paulo, Brazil.
• Link China customer requirement spec with Process engineering for the new product implement.
• Coordinate with PM、RD、QA, supplier team, make sure engineering mission and project running on schedule.
• Support the qualification reliability test verification items and fail sample Failure analysis.
• Support engineering verification , process issue analysis and quality improvement.
• Support to engineering team to communicate with China, Taiwan material and machine vendor in Chinese.

Requirement:

• Have NPI or semiconductor package process experience more than 5 years.
• Know the NPI , engineering verification, product implement or process improvement flow.
• Have semiconductor package process, reliability test, yield improvement, failure an...