Broadcom Inc. is seeking a highly skilled professional in Singapore to manage silicon bump and package assembly suppliers while driving engineering processes to meet aggressive project goals. Ideal candidates will have a PhD, Master, or Degree in Mechanical, Electrical, or Electronics Engineering with 7-12 years of relevant experience.

Responsibilities include collaboration across teams for new product introductions, continual improvement initiatives, and effective communication with suppliers. Applicants should possess a strong background in project management and AutoCAD, with a dedication to quality standards and team success.