Job Summary: The Package Health Test Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands‑on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions.
Job Profile(s): Product Development Engineer 3 - Product Development Engineer 4
Relocation Level: (TBD)
Key Responsibilities - Develop advanced packaging technology strategies focused on Test architecture, coverage and yield.
- Define, validate and optimize test coverage for both wafer and die level processes.
- Perform electrical characterization and failure analysis of advanced packages including HBM.
- Identify the need and co‑develop new DFTs with cross‑functional teams.
- Enhance test fail debugging capabilities to meet probe yield targets.
- Contribute to the APTD product roadmap from test architecture perspective.