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Packaging Engineer – Semiconductors | CAP Career Path

Company

Texas Instruments

Location

, , malaysia, , , malaysia

Posted

July 02, 2026

Position Overview

Texas Instruments in Malaysia is seeking a Packaging Engineer to participate in their Career Accelerator Program. This role involves designing semiconductor packaging technologies and collaborating with cross-functional teams to meet project requirements. Ideal candidates should have a Bachelor's degree in a relevant engineering field with a CGPA of 3.3 or higher, and fresh graduates are encouraged to apply.

Responsibilities include conducting experiments, supporting production, and ensuring that packaging technologies meet reliability standards. Texas Instruments promotes a diverse and inclusive work environment and offers growth opportunities in a dynamic setting.

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