**Job Details:**

**Job Description:**

Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical semiconductor assemblies. This role involves working in close collaboration with packaging assembly module teams, package architecture, integration, and assembly, substrate, an optical component materials supply chain, as well as semiconductor vendors and assembly/test providers worldwide. The position requires a strong understanding of optical materials and assembly process, optical component design, manufacturing, and test, active optical alignment processes. This role spans across pathfinding through high volume manufacturing for successful integrated co-packaged optics packages.

**In this role, the individual will be responsible for, but not limited to:**

+ Conducting fundamental studies and performing experiments to charac...