1、负责和参与DPU芯片的应用场景与需求分析；
2、负责和参与DPU芯片架构方案的讨论与设计；
3、负责和参与DPU芯片各子系统微架构的方案设计与编码；
4、与验证团队协同完成芯片BUG收敛，包括芯片问题定位分析、Corner点识别和覆盖率分析等；
5、负责和参与模块的物理综合和设计。

Job responsibilities:
1. Be responsible for and participate in the analysis of application scenarios and requirements of DPU chips;
2. Be responsible for and participate in the discussion and design of DPU chip architecture;
3. Be responsible for and participate in the scheme design and coding of the microarchitecture of DPU chip subsystem;
4. Cooperate with the verification team to complete chip BUG convergence, including chip problem location analysis, Corner point identification and coverage analysis, etc;
5. Be responsible for and participate in the physical synthesis and design of modules.