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12 positions, full‑time fixed‑term 3‑year positions within Tampere University’s FutureChips Postdoctoral Programme. Focus on fundamental technology and methods development for next‑generation semiconductor technologies.
Tampere University offers excellent facilities for semiconductor integration research, including photonics, chip‑level fabrication, advanced packaging, and system‑level demonstrators. Researchers have access to the System‑in‑Package Fabrication SiPFAB platform and broader semiconductor fabrication and characterization infrastructure.