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We are seeking a Principal Engineer – GaN Package Development to develop and industrialize advanced packaging technologies for GaN power devices and modules. You will drive package architecture, ensure performance, reliability, and cost targets, and lead cross-functional execution from concept through high-volume manufacturing.
This is your new job:
Lead development, optimization, and implementation of GaN packaging and assembly processes
Define package architectures aligned with performance, reliability, and cost targets
Collaborate cross-functionally (R&D, design, production, quality, purchasing) for seamless transfer to manufacturing
Specify, select, and qualify equipment, materials, and tooling
Develop and maintain process documentation, specifications, and engineering change records
Provide technical expertise to troubleshoot manufacturing issues and lead root cause analysis
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