As a Principal Engineer / Member of Technical Staff (MTS) – Dry Etch, you will spearhead groundbreaking initiatives alongside some of the industry's most accomplished technologists. Your mission is to architect and deploy next‑generation plasma etch solutions that enable future NAND scaling and novel device architectures. This role requires a technical leader who thrives on solving the toughest challenges in plasma processing, pattern transfer, process integration, and technology development driven by advanced tools.

• Develop and refine dry etch processes to satisfy NAND roadmap criteria for structure, performance, and yield.
• Guide the development of next‑generation etch solutions, encompassing high aspect ratio patterning, selective etch, profile control, and CD management.
• Evaluate new plasma chemistries, process technologies, and hardware to enable future device scaling.
• Collaborate with Process Integration, Thin Films...