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Principal Engineer

Company

STATS CHIPPAC PTE. LTD.

Location

singapore, singapore

Posted

June 18, 2026

Position Overview

            Responsibilities (Actual daily deliverables) Oversee the Process Engineering Section for Taping, BG, Wafer-mount, de-taping, LG, SAW and Automatic Optical Inspection (AOI) & TNR operations. 
Provide technical leadership for engineers to control, sustain and continuously drive improvement for yield, quality and cycle time. 
Establishing partnership and work with upstream processes such as Bumping to improve quality and yield performance. 
Establish and improve controls to ensure all products meet customers’ requirements in terms of quality and yield. 
Support on engagement with customers on improvement of process, material and equipment capabilities. 
Lead cross-functional teams such as production and equipment for out-of-control situations and provide decision on lot disposition. 
Continuously improve the yield of qualified products through systematic data analysis. 
Productivity improvement through process redesign...
        

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Principal Engineer

Position Overview

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