Our exciting new technology start-up is currently searching for an experienced, dynamic and self starting IC Packaging Engineer to be responsible for the design of complex packaging solutions for multi-die devices.

The role will involve developing and maintaining the architecture of the entire product, as well as providing expertise within the IC packaging world. Remote and hybrid working can be offered with this role.

Required skills for the Principal Semiconductor Packaging Engineer will include:

Strong IC semiconductor packaging experience and knowledge

Advanced packaging knowledge

Cadence EDA tool experience

SI/EMC analysis experience

Strong communication skills and a start-up mentality

Degree qualified

Please contact Rachel Anderson for further information.