Job Details

General Notes

About TIE

The is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.

Our Mission

A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.

Our Impact

Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

Our Technology

Our 3DHI and chiplet integration platforms integrate novel ther...