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Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Company

1100 Micron SemiAsiaOP Pte Ltd

Location

singapore, singapore

Posted

July 15, 2026

Position Overview

Key Responsibilities
  • Develop and enable advanced package technology for various post-fab wafer finish and assembly processes.
  • Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
  • Integrate semiconductors while partnering with process and product engineering teams.
  • Achieve and improve yields through silicon package integration innovation, including layout/design and process margin improvements.
  • Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes.
  • Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements.
  • Ensure defense coverage through process, measurement, inspection, and testing.
  • Establish correlations between defense mechanisms to identify improvement opportunities.
  • Conduct continuous data analysis to establish advanced controls and identify impro...

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