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Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)

Company

Intel

Location

kulim, kedah

Posted

June 07, 2026

Position Overview

Job Description

  • Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits.
  • Conducts tests and measurements of operations to ensure control over critical dimensions and defectivity of the process line.
  • Recommends and implements modifications for operating the equipment to improve production efficiencies, manufacturing techniques, and optimizing production output for existing products, to meet safety, quality and cost indicator goals.
  • Grows in‑situ manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe.
  • Owns execution of maintenance and repair activities for equipment and relevant modules of components.
  • Initiates and owns the continuous improvement of equipment and process for key performance indi...

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