To develop and to industrialize die reconstruction/die attach process including glue, soft solder, DAF and flip-bond die attach for new packages, introduce materials to meet the quality, yield and mission of new application.
To support assembly of engineering sample for new packages or new technologies.
To characterize die reconstruction/die attach process and materials.
To generate and update process specifications, SOP, FMEA and process control plan.
To provide technical support when there are critical quality concerns related to die reconstruction/die attach material / process.
Your Skills & Experiences
More than 3 years working experience.
Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.
Equi...
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