Join a leading semiconductor manufacturing environment driving advanced plating and wet process technologies.
Key Responsibilities - Develop, optimize, and sustain electroplating processes such as Cu, Ni, and SnAg
- Support wet processes including etching, cleaning, stripping, and surface preparation
- Troubleshoot plating and wet process defects to improve yield and process stability
- Conduct DOE, process qualification, SPC monitoring, and root-cause analysis
- Perform laboratory analysis including chemical titration, CVS, TOC, and failure analysis
- Collaborate with Quality, Production, and R&D teams on process and product improvements
- Support equipment maintenance, process documentation, and EHS compliance
Requirements - Degree in Chemical Engineering, Materials Engineering, Chemistry, or related field
- Experience in electroplating, semiconductor packaging, or wet chemical ...