Basic Purpose of the Job

•Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI). •Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues. •Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.

Reporting Relationship

•Reports to the Assembly Engineering Manager; leads a team of Process Engineers across Die Attach, Clip Attach, Wire Bond, Plasma and AOI.

Major Duties and Responsibilities

•Provide strategic process ownership for all FOL Package Group (SPC governance, PFMEA/Control Plan, recipe management, process capability Ppk, documentation). •Lead engineering responses to yield losses, top defect contributors, customer complaints, reliability audit failures, and GMRB cases. •Oversee execution of Continuous Improvement Plan, pr...