**Basic Purpose of the Job**

•Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).

•Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.

•Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.

**Reporting Relationship**

•Reports to the Assembly Engineering Manager; leads a team of Process Engineers across Die Attach, Clip Attach, Wire Bond, Plasma and AOI.

**onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovati...