Overview

Lead and develop the FOL Process Engineering organization (Die Attach, Clip Attach, Wire Bond, Plasma and AOI).

Ensure stable yield, high equipment/process capability, adherence to customer and reliability requirements, and timely closure of quality/EFAR/GMRB issues.

Drive continuous improvement, standardization, process governance, and readiness for volume and package‑mix expansion.

Reporting Relationship

• Reports to the Assembly Engineering Manager; leads a team of Process Engineers across Die Attach, Clip Attach, Wire Bond, Plasma and AOI.

Responsibilities

• Provide strategic process ownership for all FOL Package Group (SPC governance, PFMEA/Control Plan, recipe management, process capability Ppk, documentation).
• Lead engineering responses to yield losses, top defect contributors, customer complaints, reliability audit failures, and GMRB cases.
• Oversee execution of Continuous Improv...