Karlstad University is looking to fill up to three Process Engineer positions specializing in semiconductor packaging. You will be responsible for leading process development in areas such as flip-chip bonding and dicing.

The ideal candidate holds an M.Sc. or Ph.D. and has at least three years of experience in semiconductor packaging. This role requires hands-on problem solving and collaboration with industry and academia.

Competitive benefits include a flexible work schedule and opportunities for substantial impact in the semiconductor community.