Company Background

A leading semiconductor materials provider specializing in high-quality packaging materials, including solder spheres and solder paste, supporting advanced chip packaging and global semiconductor assembly operations.

Job Responsibilities:

• Analyse process performance and identify opportunities for continuous improvement.
• Support new product introduction (NPI), process qualification and validation activities.
• Develop, review and update process parameters, work instructions and standard operating procedures (SOPs).
• Conduct root cause analysis and implement corrective and preventive actions (CAPA) for process-related issues.
• Collaborate with Production, QA and EHS teams to resolve process abnormalities and improve manufacturing performance.
• Equipment Engineering- Manage production equipment installation, commissioning and qualification.
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