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SiPFAB aims to fill up to three Process Engineer roles. As a Process Engineer specializing in either grinding and dicing or back‑end processes for next‑generation semiconductor packaging, you will lead the development of processes such as flip‑chip bonding, die and wire bonding, screen printing, reflow, sintering, dispensing, encapsulation or dicing and grinding within our semiconductor packaging pilot‑line environment. Working as part of a multidisciplinary team, you will contribute directly to customer projects spanning academia, research institutes, and industry driving the demonstration, maturation, and commercialization of advanced packaging technologies.
In this role, you will also play a key part in process control, tool procurement, safety, user training, and equipment lifecycle management ensuring a robust and scalable process foundation for SiPFAB.